TSMC is preparing improved 3nm chip production for the second half of 2023

Despite the downtime caused by the chip shortage, TSMC reportedly continues to invest in mass production of wafers using smaller lithographs, in order to push the boundaries in chip development.

TSMC is preparing improved 3nm chip production for the second half of 2023

Photo Credits: TSMC / promo

Despite the downtime caused by the chip shortage, TSMC reportedly continues to invest in mass production of wafers using smaller lithographs, in order to push the boundaries in chip development. According to the latest information, TSMC is expected to start mass production of chips in a more advanced 3nm node during the second half of 2023.

In addition to producing standard 3nm chips, the report also mentions more advanced 3nm wafers (called N3E) that will also go into mass production. It has previously been suggested that TSMC has postponed mass production of 3nm chips for 2022, which would mean that Apple will not have access to the latest and greatest chips and would have to rely on the Taiwanese company‚Äôs 4nm technology.

However, according to the mentioned reports, TSMC is on its way to start mass production during the second half of 2022, which suggests that the Apple A16 Bionic for the iPhone 14 line will be produced without any delays. Also, Apple has managed to secure initial stocks of 3nm chips from TSMC and will have an edge over the competition in that segment.

At the moment, it is not possible to forecast the situation on the chip market in two years, when the mass production of TSMC chips is expected to start in an improved 3nm process, so these plans could be changed and adjusted to the market situation.

By: Amber V. - Zexron